general description product summary v ds i d (at v gs =10v) 72a r ds(on) (at v gs =10v) < 8.0m w (< 7.6m w * ) 100% uis tested 100% r g tested symbol v the AOT2608L/aob2608l uses trench mosfet technology that is uniquely optimized to provide th e most efficient high frequency switching performance. bot h conduction and switching power losses are minimized due to an extremely low combination of r ds(on) , ciss and coss.this device is ideal for boost converters and synchronous rectifiers for consumer, telecom, indus trial power supplies and led backlighting. drain-source voltage 60 v maximum units parameter absolute maximum ratings t a =25c unless otherwise noted 60v g d s to220 top view bottom view to-263 d 2 pak top view bottom view v ds v gs i dm i as e as t j , t stg symbol t 10s steady-state steady-state r q jc * surface mount package to263 maximum junction-to-ambient a c/w r q ja 12 48 15 v 20 gate-source voltage drain-source voltage 60 v mj avalanche current c 8.5 continuous drain current 125 11 a 50 avalanche energy l=0.1mh c a t a =25c i dsm a t a =70c i d 72 54 t c =25c t c =100c 180 pulsed drain current c continuous drain current g w power dissipation a p dsm w t a =70c 100 1.3 t a =25c t c =25c 2.1 50 t c =100c power dissipation b p d maximum junction-to-case c/w c/w maximum junction-to-ambient a d 1.2 60 1.5 units junction and storage temperature range -55 to 175 c thermal characteristics parameter typ max 1 of 6 4008-318-123 sales@twtysemi.com http://www.twtysemi.com product specification AOT2608L g g s d d s d d d d s g g s
symbol min typ max units bv dss 60 v v ds =60v, v gs =0v 1 t j =55c 5 i gss 100 na v gs(th) gate threshold voltage 2.6 3.1 3.6 v i d(on) 180 a 6.6 8 t j =125c 11.4 14 g fs 75 s v sd 0.72 1 v i s 72 a c iss 2995 pf c oss 270 pf c rss 10.5 pf r g 0.3 0.6 0.9 w q g 38.5 55 nc q gs 14 nc q gd 3.5 nc t d(on) 15 ns t 10 ns v gs =10v, i d =20a to263 m w 7.6 6.3 maximum body-diode continuous current g input capacitance output capacitance turn-on delaytime dynamic parameters turn-on rise time v =10v, v =30v, r =1.5 w , gate resistance v gs =0v, v ds =0v, f=1mhz total gate charge v gs =10v, i d =20a gate source charge gate drain charge switching parameters r ds(on) static drain-source on-resistance diode forward voltage v gs =10v, v ds =30v, i d =20a reverse transfer capacitance v gs =0v, v ds =30v, f=1mhz m w i s =1a,v gs =0v v ds =5v, i d =20a to220 forward transconductance v ds =v gs i d =250 m a electrical characteristics (t j =25c unless otherwise noted) static parameters parameter conditions i dss m a zero gate voltage drain current drain-source breakdown voltage i d =250 m a, v gs =0v v ds =0v, v gs =20v gate-body leakage current on state drain current v gs =10v, v ds =5v t r 10 ns t d(off) 25 ns t f 2.5 ns t rr 24 ns q rr 115 nc i f =20a, di/dt=500a/ m s body diode reverse recovery charge body diode reverse recovery time i f =20a, di/dt=500a/ m s turn-on rise time turn-off delaytime v gs =10v, v ds =30v, r l =1.5 w , r gen =3 w turn-off fall time a. the value of r q ja is measured with the device mounted on 1in 2 fr-4 board with 2oz. copper, in a still air environ ment with t a =25 c. the power dissipation p dsm is based on r q ja and the maximum allowed junction temperature of 150 c. the value in any given application depends on the user's specific board design, and th e maximum temperature of 175 c may be used if the pcb allows it. b. the power dissipation p d is based on t j(max) =175 c, using junction-to-case thermal resistance, and i s more useful in setting the upper dissipation limit for cases where additional heatsi nking is used. c. repetitive rating, pulse width limited by juncti on temperature t j(max) =175 c. ratings are based on low frequency and duty cycl es to keep initial t j =25 c. d. the r q ja is the sum of the thermal impedance from junction t o case r q jc and case to ambient. e. the static characteristics in figures 1 to 6 are obtained using <300 m s pulses, duty cycle 0.5% max. f. these curves are based on the junction-to-case t hermal impedance which is measured with the device mounted to a large heatsink, assuming a maximum junction temperature of t j(max) =175 c. the soa curve provides a single pulse rating. g. the maximum current limited by package. h. these tests are performed with the device mounte d on 1 in 2 fr-4 board with 2oz. copper, in a still air environ ment with t a =25 c. 2 of 6 4008-318-123 sales@twtysemi.com http://www.twtysemi.com product specification AOT2608L
typical electrical and thermal characteristics 17 5 2 10 0 18 0 20 40 60 80 100 2 3 4 5 6 i d (a) v gs (volts) figure 2: transfer characteristics (note e) 4 6 8 10 0 5 10 15 20 25 30 r ds(on) (m w w w w ) i d (a) figure 3: on-resistance vs. drain current and gate voltage (note e) 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 0 25 50 75 100 125 150 175 200 normalized on-resistance temperature (c) figure 4: on-resistance vs. junction temperature (note e) v gs =10v i d =20a 25 c 125 c v ds =5v v gs =10v 0 20 40 60 80 100 120 0 1 2 3 4 5 i d (a) v ds (volts) fig 1: on-region characteristics (note e) 6v 5v 10v vgs=4.5v 7v 40 1.0e-05 1.0e-04 1.0e-03 1.0e-02 1.0e-01 1.0e+00 1.0e+01 1.0e+02 0.0 0.2 0.4 0.6 0.8 1.0 1.2 i s (a) v sd (volts) figure 6: body-diode characteristics (note e) 25 c 125 c (note e) 3 6 9 12 15 18 2 4 6 8 10 r ds(on) (m w w w w ) v gs (volts) figure 5: on-resistance vs. gate-source voltage (note e) i d =20a 25 c 125 c 3 of 6 4008-318-123 sales@twtysemi.com http://www.twtysemi.com product specification AOT2608L
typical electrical and thermal characteristics 17 5 2 10 0 18 0 2 4 6 8 10 0 5 10 15 20 25 30 35 40 v gs (volts) q g (nc) figure 7: gate-charge characteristics 0 500 1000 1500 2000 2500 3000 3500 0 10 20 30 40 50 60 capacitance (pf) v ds (volts) figure 8: capacitance characteristics c iss 0 100 200 300 400 500 0.0001 0.001 0.01 0.1 1 10 power (w) pulse width (s) figure 10: single pulse power rating junction-to-ca se c oss c rss v ds =30v i d =20a t j(max) =175 c t c =25 c 10 m s 0.0 0.1 1.0 10.0 100.0 1000.0 0.01 0.1 1 10 100 1000 i d (amps) v ds (volts) figure 9: maximum forward biased 10 m s 10ms 1ms dc r ds(on) limited t j(max) =175 c t c =25 c 100 m s 40 (note f) 0.01 0.1 1 10 1e-05 0.0001 0.001 0.01 0.1 1 10 z q q q q jc normalized transient thermal resistance pulse width (s) figure 11: normalized maximum transient thermal imp edance (note f) single pulse d=t on /t t j,pk =t c +p dm .z q jc .r q jc t on t p d in descending order d=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse safe operating area (note f) r q jc =1.5 c/w 4 of 6 4008-318-123 sales@twtysemi.com http://www.twtysemi.com product specification AOT2608L
typical electrical and thermal characteristics 17 5 2 10 0 18 0 20 40 60 80 100 120 0 25 50 75 100 125 150 175 power dissipation (w) t case (c) figure 13: power de-rating (note f) 0 10 20 30 40 50 60 70 80 0 25 50 75 100 125 150 175 current rating i d (a) t case (c) figure 14: current de - rating (note f) 1 10 100 1000 0.001 0.01 0.1 1 10 100 1000 power (w) pulse width (s) figure 15: single pulse power rating junction - to - t a =25 c 10 100 1000 1 10 100 1000 i ar (a) peak avalanche current time in avalanche, t a ( m mm m s) figure 12: single pulse avalanche capability (note c) t a =25 c t a =150 c t a =100 c t a =125 c 40 0.001 0.01 0.1 1 10 0.001 0.01 0.1 1 10 100 1000 z q q q q ja normalized transient thermal resistance pulse width (s) figure 16: normalized maximum transient thermal imp edance (note h) single pulse d=t on /t t j,pk =t a +p dm .z q ja .r q ja t on t p d in descending order d=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse figure 14: current de - rating (note f) figure 15: single pulse power rating junction - to - ambient (note h) r q ja =60 c/w 5 of 6 4008-318-123 sales@twtysemi.com http://www.twtysemi.com product specification AOT2608L
- + vdc ig vds dut - + vdc vgs vgs 10v qg qgs qgd charge gate charge test circuit & waveform - + vdc dut vdd vgs vds vgs rl rg vgs vds 10% 90% resistive switching test circuit & waveforms t t r d(on) t on t d(off) t f t off id + l vds bv unclamped inductive switching (uis) test circuit & waveforms vds dss 2 e = 1/2 li ar ar vdd vgs vgs rg dut - + vdc vgs id vgs i ig vgs - + vdc dut l vgs vds isd isd diode recovery test circuit & waveforms vds - vds + i f ar di/dt i rm rr vdd vdd q = - idt t rr 6 of 6 4008-318-123 sales@twtysemi.com http://www.twtysemi.com product specification AOT2608L
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